Last Updated Feb - 16 - 2024, 06:34 PM | Source : PIB | Visitors : 40
Union Minister Rajeev Chandrasekhar announces Assam's first semiconductor packaging facility at the Digital India Future SKILLS Summit in Guwahati.
Shri Rajeev Chandrasekhar, Union Minister of State for Electronics and IT, Skill Development & Entrepreneurship, and Jal Shakti, has stated that Assam would soon get its first semiconductor packaging facility costing about Rs 25,000 crore. He made the news while speaking at the first-ever Digital India Future SKILLS Summit, which took place today at Gauhati University's Birinchi Kumar Baruah Auditorium.
The Minister also emphasized how India's economy has undergone significant progress over the past decade, from being ‘fragile 5’ to now ranked as world's ‘top 5’ economy. This significant milestone under the leadership of Hon’ble PM Narendra Modi has unleashed many opportunities for young Indians, particularly in emerging technology sectors where India is on the same starting line as the rest of the world.
The Digital India futureSKILLS Summit, hosted by the Ministry of Electronics and Information Technology (MeitY) through the National Institute of Electronics and IT (NIELIT), aimed to bring attention to the world of opportunities in emerging technology sectors such as semiconductors, AI, electronics, HPC, and cybersecurity.
The summit facilitated strategic collaborations between NIELIT and leading industry players and academia, such as Intel, HCL, Microsoft, Kyndryl, IIM Raipur, IIITM Gwalior, and Wipro, to bridge the gap between academia and industry, ensuring that educational programs are tailored to meet industry standards and demands.
The summit emphasized the importance of building skills for the future of technology, particularly in emerging technology sectors where India is on the same starting line as the rest of the world.
The world's biggest companies in these fields, including NVIDIA, Intel, AMD, HCL, Wipro, and IBM, are present in Guwahati, emphasizing the need for young Indians to fully immerse themselves in the world of skills. The Minister affirmed that with initiatives like futureSKILLS, India is poised to lead the way in shaping the future of technology, cultivating a globally competitive talent pool accessible not only to Indian companies but also to organizations worldwide, setting a new standard in the global tech landscape.
The summit witnessed the convergence of esteemed dignitaries, industry leaders, academia, policymakers, and technology enthusiasts to deliberate on strategies for catalyzing future-ready talent for India & the world. The Minister highlighted that FutureSKILLS is about bringing to your attention the world of opportunities in areas that require many skilled people. These futureSKILLS are needed in emerging areas like semiconductors, AI, Electronics, HPC, and cybersecurity, among others.
Hon'ble Minister of Education, Govt. of Assam, Dr. Ranoj Pegu, said that the Government of Assam has taken many steps for digital skilling of youths in Assam. Projects worth Rs. 1800 crore have been implemented by the Assam Govt. to skill our youths on industry 4.0 across 77 polytechnics and ITIs. Recently, an agreement has been signed with TATA and allotted 150-acre land to establish semiconductor industry near Guwahati.
Key speakers at the summit included Sh. Kuntal Sensarma, Economic Adviser, MeitY, Ms. Jaya Jagadish, Head, AMD India, Shri. Ruchir Dixit, Vice President & Country Manager, Siemens EDA, Shri Lingraju Sawkar, President, Kyndryl India, Shri. Ganesh Gopalan, CEO and Co-Founder, Gnani.AI, and Prof. Subhasis Chaudhuri, Director, IIT Bombay.
Sh. Kuntal Sensarma, Joint Secretary & Economic Adviser, MeitY, underlined that skills are the passport to prosperity and that the summit will help to formulate a roadmap to transform India into a global talent hub and capitalize on the opportunities thrown up by Emerging Technologies. The presence of prominent industry leaders in Guwahati underscored the significance of empowering the youth of Assam and the entire region with digital skills.
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